UltraHard Materials LLC
Comparing UHM’s CeTZP with Silicon Nitride
Silicon Nitride is probably the most common engineering ceramic that is currently being used in applications where a higher performance material is required despite its low fracture toughness.
Table 8
Table 8 lists the mechanical properties of UHM’s CeTZP compared to Silicon Nitride (from references 4,5,7,15).
Mechanical Properties
|
UHM's CeTZP
|
Silicon Nitride
|
Vickers Hardness (GPa)
|
9.1 - 13.6+
|
17 - 19+
|
Fracture Toughness (MPa.m1/2)
|
10 - 15.3
|
4.0 - 5.4
|
Tensile Strength (MPa)
|
360 - 420#
|
400 - 580#
|
Bend Strength (MPa)
|
1080 - 1260
|
190 - 980
|
Compression Strength (MPa)
|
1045 - 1459
|
550 - 2000
|
Young’s Modulus (GPa)
|
190 - 200
|
280 - 310
|
Density (g/cm3)
|
6.1 - 6.2
|
3.2 - 3.5
|
#estimated from bend strength
+ higher values can be obtained when lower indenter loads are used during Vickers hardness measurements (reference 10).
[All our mechanical tests were carried out on UHM's CeTZP billets. A LECO test machine for our indentation macrohardness tests utilized 30 kg loads; K1c values were calculated from crack lengths derived from these indentation tests using the equation of Anstis el alia (reference 10)]
UHM’s CeTZP engineering ceramic has some clear mechanical property advantages over Silicon Nitride and they are:
-
The fracture toughness of UHM’s CeTZP is about three times (or 300%) higher than Silicon Nitride. This means that UHM’s CeTZP is less likely to fracture under higher load-bearing conditions than Silicon Nitride
-
The Bend Strength of UHM’s CeTZP is higher than that of Silicon Nitride
Table 9
Table 9 lists the thermal properties of CeTZP compared to Silicon Nitride (from references 4,5,7,15)
Thermal Properties
|
UHM’s CeTZP
|
Silicon Nitride
|
Thermal Expansion Coefficient (10-6/K)
|
10 - 12
|
2.6 - 3.3
|
Thermal Conductivity (W/m.K)
|
1.9
|
15 - 43
|
CeTZP engineering ceramic has some thermal property advantages over Silicon Nitride and they are:
-
The thermal expansion coefficient of CeTZP is comparable to that of cast iron (Silicon Nitride has a much lower thermal expansion coefficient which would make Silicon Nitride a mismatch with cast iron)
-
CeTZP has a lower thermal conductivity than Silicon Nitride. Thus, CeTZP is a better candidate material than Silicon Nitride for heat engines.